LB Semicon Inc. (KOSDAQ:061970)

Market Cap	236.68B +37.4%
Revenue (ttm)	463.50B +0.8%
Net Income	-28.64B
EPS	-548.44
Shares Out	56.55M
PE Ratio	n/a
Forward PE	n/a
Dividend	n/a
Ex-Dividend Date	n/a

Volume	345,661
Average Volume	401,914
Open	4,170.00
Previous Close	4,280.00
Day's Range	3,955.00 - 4,285.00
52-Week Range	2,835.00 - 6,100.00
Beta	1.04
RSI	48.60
Earnings Date	Feb 27, 2026

About LB Semicon

LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser ma...

• Industry: Semiconductors
• Sector: Technology
• Founded: 2000
• Employees: 1,569
• Stock Exchange: KOSDAQ
• Ticker Symbol: 061970

Financial Performance

In 2024, LB Semicon's revenue was 450.86 billion, an increase of 8.15% compared to the previous year's 416.87 billion. Losses were -22.18 billion, 46.1% more than in 2023.