LB Semicon Inc. (KOSDAQ:061970)

Market Cap	234.98B +6.6%
Revenue (ttm)	479.78B +6.4%
Net Income	-150.86B
EPS	-2,717.00
Shares Out	56.55M
PE Ratio	n/a
Forward PE	n/a
Dividend	n/a
Ex-Dividend Date	n/a

Volume	194,466
Average Volume	323,680
Open	4,080.00
Previous Close	3,980.00
Day's Range	4,030.00 - 4,160.00
52-Week Range	2,835.00 - 6,100.00
Beta	1.12
RSI	46.44
Earnings Date	May 15, 2026

About LB Semicon

LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser ma...

• Industry: Semiconductors
• Sector: Technology
• Founded: 2000
• Employees: 1,569
• Stock Exchange: KOSDAQ
• Ticker Symbol: 061970

Financial Performance

In 2025, LB Semicon's revenue was 479.78 billion, an increase of 6.41% compared to the previous year's 450.86 billion. Losses were -150.86 billion, 580.1% more than in 2024.