LB Semicon Inc. (KOSDAQ:061970)

Market Cap	303.13B +56.0%
Revenue (ttm)	479.78B +6.4%
Net Income	-150.86B
EPS	-2,717.00
Shares Out	56.55M
PE Ratio	n/a
Forward PE	n/a
Dividend	n/a
Ex-Dividend Date	n/a

Volume	763,478
Average Volume	1,757,789
Open	5,480.00
Previous Close	5,360.00
Day's Range	5,470.00 - 5,890.00
52-Week Range	3,080.00 - 7,120.00
Beta	n/a
RSI	51.25
Earnings Date	May 22, 2026

About LB Semicon

LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser ma...

• Industry: Semiconductors
• Sector: Technology
• Founded: 2000
• Employees: 1,569
• Stock Exchange: KOSDAQ
• Ticker Symbol: 061970

Financial Performance

In 2025, LB Semicon's revenue was 479.78 billion, an increase of 6.41% compared to the previous year's 450.86 billion. Losses were -150.86 billion, 580.1% more than in 2024.