South Korea
· Delayed Price · Currency is KRW LB Semicon Company Description
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea.
It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products.
The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel.
LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
| Country | South Korea |
| Founded | 2000 |
| Industry | Semiconductors and Related Devices |
| Employees | 894 |
| CEO | Noh-Man Park |
Contact Details
Address: 138, Cheongbuksandan-ro Pyeongtaek-Si, Gyeonggi-do Gyeonggi-do South Korea | |
| Phone | 82 3 1680 1600 |
| Website | lbsemicon.com |
Stock Details
| Ticker Symbol | 061970 |
| Exchange | KOSDAQ |
| Fiscal Year | January - December |
| Reporting Currency | KRW |
| SIC Code | 3674 |
Key Executives
| Name | Position |
|---|---|
| Noh-Man Park | Chief Executive Officer |