Hor Kew Corporation Limited (SGX:BBP)
Singapore · Delayed Price · Currency is SGD 1.330
+0.020 (1.53%)
At close: Jan 20, 2026
Hor Kew Corporation Dividend Information
Dividend Yield
2.29%
Annual Dividend
0.03 SGD
Ex-Dividend Date
n/a
Payout Frequency
n/a
Payout Ratio
10.47%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 8, 2025 | 0.030 SGD | May 30, 2025 |
* Dividend amounts are adjusted for stock splits when applicable.