Hor Kew Corporation Limited (SGX:BBP)
Singapore
· Delayed Price · Currency is SGD 0.6050
-0.0050 (-0.82%)
Last updated: Apr 9, 2025
Hor Kew Corporation Dividend Information
Hor Kew Corporation has an annual dividend of 0.03 SGD per share, with a yield of 4.62%. The next ex-dividend date is May 8, 2025.
Dividend Yield
4.62%
Annual Dividend
0.03 SGD
Ex-Dividend Date
May 8, 2025
Payout Frequency
n/a
Payout Ratio
n/a
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 8, 2025 | 0.030 SGD | May 30, 2025 |
* Dividend amounts are adjusted for stock splits when applicable.