Hor Kew Corporation Limited (SGX:BBP)
Singapore · Delayed Price · Currency is SGD 1.240
+0.020 (1.64%)
At close: Oct 6, 2026
Hor Kew Corporation Dividend Information
Hor Kew Corporation has an annual dividend of 0.015 SGD per share, with a yield of 1.21%. The dividend is paid once per year and the last ex-dividend date was May 7, 2026.
Dividend Yield
1.21%
Annual Dividend
0.015 SGD
Ex-Dividend Date
May 7, 2026
Payout Frequency
Annual
Payout Ratio
4.50%
Dividend Growth(1Y)
-50.00%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.