Tellhow Sci-Tech Co., Ltd. (SHA:600590)
9.23
+0.25 (2.78%)
Jul 10, 2026, 3:00 PM CST
Tellhow Sci-Tech Dividend Information
Tellhow Sci-Tech has an annual dividend of 0.023 CNY per share, with a yield of 0.25%. The last ex-dividend date was Jun 25, 2026.
Dividend Yield
0.25%
Annual Dividend
0.023 CNY
Ex-Dividend Date
Jun 25, 2026
Payout Frequency
n/a
Payout Ratio
210.36%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 25, 2026 | 0.023 CNY | Jun 25, 2026 |
* Dividend amounts are adjusted for stock splits when applicable.