Tellhow Sci-Tech Co., Ltd. (SHA:600590)

Tellhow Sci-Tech Dividend Information

Tellhow Sci-Tech has an annual dividend of 0.023 CNY per share, with a yield of 0.34%. The last ex-dividend date was Jun 25, 2026.

• Dividend Yield: 0.34%
• Annual Dividend: 0.023 CNY
• Ex-Dividend Date: Jun 25, 2026
• Payout Frequency: n/a
• Payout Ratio: 265.82%
• Dividend Growth: n/a

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
Jun 25, 2026	0.023 CNY	Jun 24, 2026	Jun 25, 2026

* Dividend amounts are adjusted for stock splits when applicable.

Data Source: S&P Global Market Intelligence Last updated: Jun 25, 2026

Dividend data is provided by S&P Global Market Intelligence and updates within hours after each dividend announcement, which is every three months for this company.

Update frequency:

Quarterly

Last checked:

Nov 11, 2026

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