Union Semiconductor (Hefei) Co., Ltd. (SHA:688403)
China · Delayed Price · Currency is CNY 13.96
-0.12 (-0.85%)
At close: Aug 22, 2025, 2:57 PM CST
Union Semiconductor (Hefei) Company Description
Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for integrated circuits in China.
The company offers front-end gold bumps, wafer bumps, wafer testing, back-end chip-on-glass packaging, film-on-chip packaging, tape and reel chip package, and turnkey packaging and testing services for driver integrated circuits.
Its products are used in TVs, laptops, mobile phones, tablets, digital cameras, and other consumer electronics.
The company was founded in 2011 and is headquartered in Hefei, China.
Union Semiconductor (Hefei) Co., Ltd.
| Country | China |
| Founded | 2011 |
| Industry | Semiconductors |
| Sector | Technology |
| Employees | 1,559 |
| CEO | Ruijun Zheng |
Contact Details
Address: No. 8, Xiangwang Road Hefei, 230012 China | |
| Phone | 86 551 6713 9968 |
| Website | unionsemicon.com.cn |
Stock Details
| Ticker Symbol | 688403 |
| Exchange | Shanghai Stock Exchange |
| Fiscal Year | January - December |
| Reporting Currency | CNY |
| ISIN Number | CNE100005PP0 |
| SIC Code | 3674 |
Key Executives
| Name | Position |
|---|---|
| Ruijun Zheng | Chairman and GM |
| Xie Xi | Secretary to the Board |
| Zhenfang Huang | Deputy General Manager |
| Wenhao Lin | Deputy GM, Director of Research & Development Center and Core Technical Personnel |
| Xingtian Ma | Deputy General Manager |
| Yuxuan Zhong | Deputy GM, Core Tech. Personnel, Deputy Director of Research & Development Center and Director of Manufacturing Dept. |