Union Semiconductor (Hefei) Company Description

Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for integrated circuits in China.

The company offers front-end gold bumps, wafer bumps, wafer testing, back-end chip-on-glass packaging, film-on-chip packaging, tape and reel chip package, and turnkey packaging and testing services for driver integrated circuits.

Its products are used in TVs, laptops, mobile phones, tablets, digital cameras, and other consumer electronics.

The company was founded in 2011 and is headquartered in Hefei, China.

Union Semiconductor (Hefei) Co., Ltd.

Country	China
Founded	2011
Industry	Semiconductors
Sector	Technology
Employees	1,559
CEO	Ruijun Zheng

Contact Details

Address: No. 8, Xiangwang Road Hefei, 230012 China
Phone	86 551 6713 9968
Website	unionsemicon.com.cn

Stock Details

Ticker Symbol	688403
Exchange	Shanghai Stock Exchange
Fiscal Year	January - December
Reporting Currency	CNY
ISIN Number	CNE100005PP0
SIC Code	3674

Key Executives

Name	Position
Ruijun Zheng	Chairman and GM
Xie Xi	Secretary to the Board
Zhenfang Huang	Deputy General Manager
Wenhao Lin	Deputy GM, Director of Research & Development Center and Core Technical Personnel
Xingtian Ma	Deputy General Manager
Yuxuan Zhong	Deputy GM, Core Tech. Personnel, Deputy Director of Research & Development Center and Director of Manufacturing Dept.