Union Semiconductor (Hefei) Company Description

Union Semiconductor (Hefei) Co., Ltd. provides packaging and testing services for integrated circuits to display driver chip design companies in China and internationally.

The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services.

Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, and electronic tags categories.

The company was founded in 2015 and is headquartered in Hefei, China.

Union Semiconductor (Hefei) Co., Ltd.

Country	China
Founded	2015
Industry	Semiconductors
Sector	Technology
Employees	1,588
CEO	Ruijun Zheng

Contact Details

Address: No. 8, Xiangwang Road Hefei, 230012 China
Phone	86 551 6713 9968
Website	unionsemicon.com.cn

Stock Details

Ticker Symbol	688403
Exchange	Shanghai Stock Exchange
Fiscal Year	January - December
Reporting Currency	CNY
ISIN Number	CNE100005PP0
SIC Code	3674

Key Executives

Name	Position
Ruijun Zheng	Chairman and GM
Liu Yan	Chief Financial Officer
Xie Xi	Secretary to the Board
Zhenfang Huang	Deputy General Manager
Wenhao Lin	Deputy GM and Director of Research & Development Center
Xingtian Ma	Deputy General Manager
Yuxuan Zhong	Deputy GM and Deputy Director of Research & Development Center
Xin Lu Chen	Accounting Supervisor
Yuan Cheng Xu	Core Technical Personnel, Director of Research & Development Center and Director of Manufacturing Department
Han Zong Chen	Core Technical Personnel, Director of Research & Development Center and Director of Manufacturing Department