Union Semiconductor (Hefei) Co., Ltd. (SHA:688403)

SHA:688403 Dividend Information

SHA:688403 has an annual dividend of 0.05 CNY per share, with a yield of 0.21%. The dividend is paid once per year and the last ex-dividend date was May 20, 2026.

• Dividend Yield: 0.21%
• Annual Dividend: 0.05 CNY
• Ex-Dividend Date: May 20, 2026
• Payout Frequency: Annual
• Payout Ratio: 84.95%
• Dividend Growth: -47.37%

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
May 20, 2026	0.050 CNY	May 19, 2026	May 20, 2026
May 16, 2025	0.095 CNY	May 15, 2025	May 16, 2025
Jun 6, 2024	0.100 CNY	Jun 5, 2024	Jun 6, 2024

* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts

Data Source: S&P Global Market Intelligence Last updated: May 20, 2026

Dividend data is provided by S&P Global Market Intelligence and updates within hours after each dividend announcement, which is every year for this company.

Update frequency:

Yearly

Last checked:

Sep 10, 2026

Data Sources Report a data error

Stock Analysis Pro

Upgrade now for unlimited access to all data and tools.

Market Newsletter

Get a daily email with the top market news in bullet point format.