Wafer Works (Shanghai) Dividend Information

Dividend Yield

1.18%

Annual Dividend

0.20 CNY

Ex-Dividend Date

n/a

Payout Frequency

n/a

Payout Ratio

181.75%

Dividend Growth

n/a

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
Jul 22, 2024	0.29847 CNY	Jul 19, 2024	Jul 22, 2024

* Dividend amounts are adjusted for stock splits when applicable.