Wafer Works (Shanghai) Co., Ltd. (SHA:688584)
China · Delayed Price · Currency is CNY 23.47
+0.34 (1.47%)
At close: Feb 12, 2026
Wafer Works (Shanghai) Dividend Information
Wafer Works (Shanghai) has an annual dividend of 0.20 CNY per share, with a yield of 0.86%. The dividend is paid once per year and the last ex-dividend date was Jun 18, 2025.
Dividend Yield
0.86%
Annual Dividend
0.20 CNY
Ex-Dividend Date
Jun 18, 2025
Payout Frequency
Annual
Payout Ratio
101.09%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 18, 2025 | 0.200 CNY | Jun 18, 2025 |
| Jul 22, 2024 | 0.29847 CNY | Jul 22, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.