Wafer Works (Shanghai) Co., Ltd. (SHA:688584)
China · Delayed Price · Currency is CNY 27.64
-2.07 (-6.97%)
At close: Jul 28, 2026
Wafer Works (Shanghai) Dividend Information
Dividend Yield
0.34%
Annual Dividend
0.10 CNY
Ex-Dividend Date
n/a
Payout Frequency
Annual
Payout Ratio
119.85%
Dividend Growth(1Y)
n/a
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 18, 2025 | 0.200 CNY | Jun 18, 2025 |
| Jul 22, 2024 | 0.29847 CNY | Jul 22, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.