Wafer Works (Shanghai) Co., Ltd. (SHA:688584)
China · Delayed Price · Currency is CNY 20.51
-0.52 (-2.47%)
At close: Apr 28, 2026
Wafer Works (Shanghai) Dividend Information
Wafer Works (Shanghai) has an annual dividend of 0.10 CNY per share, with a yield of 0.48%. The dividend is paid once per year and the last ex-dividend date was Jun 18, 2025.
Dividend Yield
0.48%
Annual Dividend
0.10 CNY
Ex-Dividend Date
Jun 18, 2025
Payout Frequency
Annual
Payout Ratio
111.72%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 18, 2025 | 0.200 CNY | Jun 18, 2025 |
| Jul 22, 2024 | 0.29847 CNY | Jul 22, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.