Wafer Works (Shanghai) Co., Ltd. (SHA:688584)
China flag China · Delayed Price · Currency is CNY
28.54
-0.40 (-1.38%)
At close: Aug 26, 2026

Wafer Works (Shanghai) Dividend Information

Wafer Works (Shanghai) has an annual dividend of 0.10 CNY per share, with a yield of 0.34%. The dividend is paid once per year and the last ex-dividend date was Aug 13, 2026.

Dividend Yield
0.34%
Annual Dividend
0.10 CNY
Ex-Dividend Date
Aug 13, 2026
Payout Frequency
Annual
Payout Ratio
119.85%
Dividend Growth
-50.28%

Dividend History

Ex-Div Date AmountRecord DatePay Date
Aug 13, 20260.09944 CNYAug 12, 2026Aug 13, 2026
Jun 18, 20250.200 CNYJun 17, 2025Jun 18, 2025
Jul 22, 20240.29847 CNYJul 19, 2024Jul 22, 2024
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts