Wafer Works (Shanghai) Co., Ltd. (SHA:688584)
27.88
+3.10 (12.51%)
At close: Sep 16, 2026
Wafer Works (Shanghai) Dividend Information
Wafer Works (Shanghai) has an annual dividend of 0.10 CNY per share, with a yield of 0.38%. The dividend is paid once per year and the last ex-dividend date was Aug 13, 2026.
Dividend Yield
0.38%
Annual Dividend
0.10 CNY
Ex-Dividend Date
Aug 13, 2026
Payout Frequency
Annual
Payout Ratio
18.56%
Dividend Growth(1Y)
-50.28%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.