Hebei Sinopack Electronic Technology Co.,Ltd. Dividend Information

Dividend Yield

0.57%

Annual Dividend

0.28 CNY

Ex-Dividend Date

n/a

Payout Frequency

n/a

Payout Ratio

25.30%

Dividend Growth

n/a

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
Jun 11, 2024	0.390 CNY	Jun 7, 2024	Jun 11, 2024
Jun 10, 2022	0.10714 CNY	Jun 9, 2022	Jun 10, 2022
Jun 10, 2021	0.13265 CNY	Jun 9, 2021	Jun 10, 2021

* Dividend amounts are adjusted for stock splits when applicable.