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HP Inc. (SNSE:HPQCL)
Chile flag Chile · Delayed Price · Currency is CLP
31,368
0.00 (0.00%)
At close: Sep 25, 2026

SNSE:HPQCL Dividend Information

HP Inc. has an annual dividend of 1,096.60 CLP per share, with a yield of 3.50%. The dividend is paid every three months and the last ex-dividend date was Sep 9, 2026.

Dividend Yield
3.50%
Annual Dividend
1,096.60 CLP
Ex-Dividend Date
Sep 9, 2026
Payout Frequency
Quarterly
Payout Ratio
44.68%
Dividend Growth
-0.75%

Dividend History

Ex-Div Date AmountRecord DatePay Date
Sep 9, 2026277.476 CLPSep 9, 2026Oct 7, 2026
Jun 10, 2026274.890 CLPJun 10, 2026Jul 1, 2026
Mar 11, 2026267.039 CLPMar 11, 2026Apr 1, 2026
Dec 11, 2025277.194 CLPDec 11, 2025Jan 2, 2026
Sep 10, 2025279.73404 CLPSep 10, 2025Oct 1, 2025
Jun 11, 2025272.14597 CLPJun 11, 2025Jul 2, 2025
Mar 12, 2025270.21278 CLPMar 12, 2025Apr 2, 2025
Dec 11, 2024282.74959 CLPDec 11, 2024Jan 2, 2025
Sep 11, 2024262.03221 CLPSep 11, 2024Oct 2, 2024
Jun 12, 2024254.64338 CLPJun 12, 2024Jul 3, 2024
Mar 12, 2024266.83316 CLPMar 13, 2024Apr 3, 2024
Dec 12, 2023243.45953 CLPDec 13, 2023Jan 3, 2024
Sep 12, 2023234.49125 CLPSep 13, 2023Oct 4, 2023
Jun 13, 2023210.93975 CLPJun 14, 2023Jul 5, 2023
Mar 7, 2023211.45163 CLPMar 8, 2023Apr 5, 2023
Dec 13, 2022225.04125 CLPDec 14, 2022Jan 4, 2023
Sep 13, 2022229.3775 CLPSep 14, 2022Oct 5, 2022
Jun 7, 2022206.850 CLPJun 8, 2022Jul 6, 2022
Mar 8, 2022202.6925 CLPMar 9, 2022Apr 6, 2022
Dec 7, 2021209.99375 CLPDec 8, 2021Jan 5, 2022
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts