HP Inc. (SWX:HPQ)
24.05
0.00 (0.00%)
At close: Aug 21, 2026
SWX:HPQ Dividend Information
HP Inc. has an annual dividend of 0.95 CHF per share, with a yield of 3.96%. The dividend is paid every three months and the next ex-dividend date is Sep 9, 2026.
Dividend Yield
3.96%
Annual Dividend
0.95 CHF
Ex-Dividend Date
Sep 9, 2026
Payout Frequency
Quarterly
Payout Ratio
42.81%
Dividend Growth(1Y)
-2.61%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.