VIA Technologies Company Description
VIA Technologies, Inc. engages in the programming, design, manufacture, and sale of semiconductors and PC chip sets.
The company offers automotive solutions, including a range of VIA Mobile360 systems and devices that use a suite of AI-powered people detection, driver safety system, and sensor fusion technologies; building solutions that consists of access control systems, video intercom systems, doorbell and alarm systems, integrating leading-edge camera, and connectivity technologies; and industrial solutions, including plastic bag stitching inspection, wafer inspection, smoke detection, worker PPE inspection, worker PPE class 2/4 inspection, and pipeline weld inspection.
It also provides edge modules, such as VIA SOM-7000, VIA SOM-5000, and VIA SOM-3000; edge boards, such as VIA VAB-5000, VIA VAB-3000, and VIA EPIA-M930; and VIA AI Transforma Model 1 platform; and edge systems comprising the VIA ARTiGO series systems and VIA AMOS.
VIA Technologies, Inc. was founded in 1987 and is headquartered in New Taipei City, Taiwan.

| Country | Taiwan |
| Founded | 1987 |
| Industry | Semiconductors |
| Sector | Technology |
| Employees | 983 |
| CEO | Wen-Chi Chen |
Contact Details
Address: No. 533 Zhongzheng Road New Taipei City, 231 Taiwan | |
| Phone | 886 2 2218 5452 |
| Website | viatech.com |
Stock Details
| Ticker Symbol | 2388 |
| Exchange | Taiwan Stock Exchange |
| Fiscal Year | January - December |
| Reporting Currency | TWD |
| ISIN Number | TW0002388006 |
| SIC Code | 3674 |
Key Executives
| Name | Position |
|---|---|
| Wen-Chi Chen | Chairman of the Board, Chief Executive Officer, President and GM |
| Dr. Tzumu Lin | Senior Vice President and Director |
| Bao-Huei Chen | Vice President, Chief Financial Officer and Accounting Supervisor |