VIA Technologies, Inc. (TPE:2388)
76.90
+2.50 (3.36%)
May 29, 2026, 1:30 PM CST
VIA Technologies Dividend Information
VIA Technologies has an annual dividend of 0.20 TWD per share, with a yield of 0.26%. The dividend is paid once per year and the next ex-dividend date is Jun 22, 2026.
Dividend Yield
0.26%
Annual Dividend
0.20 TWD
Ex-Dividend Date
Jun 22, 2026
Payout Frequency
Annual
Payout Ratio
108.78%
Dividend Growth(1Y)
-75.00%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 22, 2026 | 0.050 TWD | Jul 17, 2026 |
| Jun 20, 2025 | 0.200 TWD | Jul 18, 2025 |
| Jun 20, 2024 | 0.100 TWD | Jul 19, 2024 |
| Jun 16, 2023 | 0.150 TWD | Jul 19, 2023 |
| Apr 7, 2022 | 0.99979 TWD | May 6, 2022 |
| Aug 19, 2021 | 0.800 TWD | Sep 17, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.