Kinsus Interconnect Technology Corp. (TPE:3189)

Market Cap	222.00B +592.5%
Revenue (ttm)	41.84B +30.1%
Net Income	1.87B +522.1%
EPS	3.89 +487.8%
Shares Out	456.79M
PE Ratio	125.00
Forward PE	35.61
Dividend	1.75 (0.34%)
Ex-Dividend Date	Jul 3, 2025

Volume	33,316,313
Average Volume	36,092,498
Open	536.00
Previous Close	522.00
Day's Range	480.00 - 537.00
52-Week Range	77.00 - 556.00
Beta	1.45
RSI	54.70
Earnings Date	Aug 7, 2026

About TPE:3189

Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic b...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 2000
• Employees: 3,801
• Stock Exchange: Taiwan Stock Exchange
• Ticker Symbol: 3189

Financial Performance

In 2025, TPE:3189's revenue was 39.35 billion, an increase of 28.87% compared to the previous year's 30.53 billion. Earnings were 1.60 billion, an increase of 3164.41%.