Hiwin Mikrosystem Corporation (TPE:4576)
229.00
-4.00 (-1.72%)
Jun 4, 2026, 1:30 PM CST
Hiwin Mikrosystem Dividend Information
Hiwin Mikrosystem has an annual dividend of 0.80 TWD per share, with a yield of 0.34%. The dividend is paid once per year and the next ex-dividend date is Jul 8, 2026.
Dividend Yield
0.34%
Annual Dividend
0.80 TWD
Ex-Dividend Date
Jul 8, 2026
Payout Frequency
Annual
Payout Ratio
7.89%
Dividend Growth(1Y)
300.00%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jul 8, 2026 | 0.800 TWD | Aug 5, 2026 |
| Jul 17, 2025 | 0.200 TWD | Aug 15, 2025 |
| Jul 17, 2024 | 0.100 TWD | Aug 8, 2024 |
| Jul 19, 2023 | 1.000 TWD | Aug 10, 2023 |
| Jul 20, 2022 | 1.000 TWD | Aug 11, 2022 |
| Aug 20, 2021 | 0.29703 TWD | Sep 14, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.