Tong Hsing Electronic Industries, Ltd. (TPE: 6271)

Market Cap	28.01B
Revenue (ttm)	11.88B
Net Income (ttm)	1.57B
Shares Out	209.06M
EPS (ttm)	7.49
PE Ratio	17.89
Forward PE	16.12
Dividend	2.40 (1.83%)
Ex-Dividend Date	Jun 27, 2024

Volume	425,214
Open	134.50
Previous Close	134.50
Day's Range	132.00 - 135.00
52-Week Range	111.00 - 171.50
Beta	1.09
Analysts	n/a
Price Target	n/a
Earnings Date	Nov 8, 2024

About Tong Hsing Electronic Industries

Tong Hsing Electronic Industries, Ltd. develops and produces thick film substrates and customized semiconductor micro-module packaging products. The company provides direct plated and bonded copper, active metal brazing, and thick film printed circuit substrate products; CMOS imaging products comprising wafer probing testing, wafer reconstruction, packaging, and image testing; and module packaging products, such as high frequency wireless communication modules and power semiconductors. It offers customized module packaging and testing products,...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1974
• Employees: 1,400
• Stock Exchange: Taiwan Stock Exchange
• Ticker Symbol: 6271

Financial Performance

In 2023, Tong Hsing Electronic Industries's revenue was 11.58 billion, a decrease of -17.67% compared to the previous year's 14.07 billion. Earnings were 1.15 billion, a decrease of -63.37%.