Tong Hsing Electronic Industries, Ltd. (TPE:6271)

Market Cap	50.91B +125.5%
Revenue (ttm)	11.45B -4.8%
Net Income	1.41B -27.0%
EPS	6.72 -26.9%
Shares Out	209.06M
PE Ratio	36.24
Forward PE	28.04
Dividend	3.00 (1.20%)
Ex-Dividend Date	Jun 10, 2026

Volume	1,983,333
Open	249.50
Previous Close	250.00
Day's Range	242.00 - 249.50
52-Week Range	96.80 - 268.50
Beta	1.06
Analysts	Hold
Price Target	184.75 (-24.13%)
Earnings Date	Jul 28, 2026

About TPE:6271

Tong Hsing Electronic Industries, Ltd. engages in the development and production of thick film substrates and customized semiconductor micro-module packaging. It offers ceramic metalized substrate, such as direct plated copper, direct bonded copper, active metal brazing, and thick film printed circuit substrates; CMOS imaging products, including wafer probing and testing, wafer reconstruction, and packaging, and image testing. The company also provides high frequency wireless communication modules and power semiconductors module packaging produ...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1974
• Employees: 1,400
• Stock Exchange: Taiwan Stock Exchange
• Ticker Symbol: 6271

Financial Performance

In 2025, TPE:6271's revenue was 11.54 billion, a decrease of -4.53% compared to the previous year's 12.09 billion. Earnings were 1.60 billion, a decrease of -6.80%.