Tong Hsing Electronic Industries Company Description

Tong Hsing Electronic Industries, Ltd. develops and produces thick film substrates and customized semiconductor micro-module packaging products.

The company provides direct plated and bonded copper, active metal brazing, and thick film printed circuit substrate products; CMOS imaging products comprising wafer probing testing, wafer reconstruction, packaging, and image testing; and module packaging products, such as high frequency wireless communication modules and power semiconductors.

It offers customized module packaging and testing products, including hybrid integrated circuit modules and biomedical products; and packaging services and substrate manufacturing technologies.

In addition, the company provides wafer probing, backgrinding, wafer reconstruction, assembly, automated inspection, and finished module testing services for image sensor, MEMS and biomedical inspection products.

Its products are used in automotive, aerospace, handset, wireless communication, MEMS, image sensor, optoelectronic semiconductor components, LED, solar cells, and medical electronics, and networking equipment.

The company was incorporated in 1974 and is headquartered in New Taipei City, Taiwan.

Tong Hsing Electronic Industries, Ltd.

Country	Taiwan
Founded	1974
Industry	Semiconductor Equipment & Materials
Sector	Technology
Employees	1,400
CEO	Shao-Pin Ru

Contact Details

Address: No.55, Yingtao Road New Taipei City Taiwan
Phone	886 2 2679 0122
Website	theil.com

Stock Details

Ticker Symbol	6271
Exchange	Taiwan Stock Exchange
Stock Type	Common Stock
Fiscal Year	January - December
Reporting Currency	TWD
ISIN Number	TW0006271000
SIC Code	3674

Key Executives

Name	Position
Shao-Pin Ru	General Manager
Shao-Ping Lu	President
Chia-Li Huang	Accounting Supervisor, Chief Operating Officer, Chief Financial Officer and Director
Shih-Yi Yu	Chief Internal Auditor