Taiwan IC Packaging Corporation (TPEX: 3372)

Market Cap	2.96B
Revenue (ttm)	935.39M
Net Income (ttm)	-186.57M
Shares Out	175.32M
EPS (ttm)	-1.07
PE Ratio	n/a
Forward PE	n/a
Dividend	n/a
Ex-Dividend Date	n/a

Volume	189,412
Open	17.10
Previous Close	17.05
Day's Range	16.90 - 17.10
52-Week Range	13.60 - 26.80
Beta	n/a
Analysts	n/a
Price Target	n/a
Earnings Date	Nov 1, 2024

About Taiwan IC Packaging

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company’s products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. The company was founded in 1998 and is headquartered in Kaohsiung, Taiwan.

• Industry: Semiconductors
• Sector: Technology
• Founded: 1998
• Employees: 392
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 3372