Taiwan IC Packaging Corporation (TPEX:3372)

Market Cap	3.83B +51.7%
Revenue (ttm)	1.10B +21.6%
Net Income	-213.69M
EPS	-1.22
Shares Out	175.32M
PE Ratio	n/a
Forward PE	n/a
Dividend	n/a
Ex-Dividend Date	n/a

Volume	944,079
Average Volume	2,208,489
Open	21.85
Previous Close	22.10
Day's Range	21.50 - 22.40
52-Week Range	10.10 - 26.20
Beta	0.63
RSI	48.43
Earnings Date	Mar 12, 2026

About Taiwan IC Packaging

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is headquartered in Kaohsiung, Taiwan.

• Industry: Semiconductors
• Sector: Technology
• Founded: 1998
• Employees: 435
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 3372

Financial Performance

In 2025, Taiwan IC Packaging's revenue was 1.10 billion, an increase of 21.56% compared to the previous year's 904.16 million. Losses were -213.69 million, 15.3% more than in 2024.