Taiwan IC Packaging Corporation (TPEX:3372)

Market Cap	3.09B
Revenue (ttm)	1.02B
Net Income (ttm)	-243.78M
Shares Out	175.32M
EPS (ttm)	-1.39
PE Ratio	n/a
Forward PE	n/a
Dividend	n/a
Ex-Dividend Date	n/a

Volume	846,018
Average Volume	1,418,775
Open	17.50
Previous Close	17.45
Day's Range	17.50 - 18.40
52-Week Range	10.10 - 20.45
Beta	0.48
RSI	55.04
Earnings Date	Oct 28, 2025

About Taiwan IC Packaging

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company’s products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is headquartered in Kaohsiung, Taiwan.

• Industry: Semiconductors
• Sector: Technology
• Founded: 1998
• Employees: 435
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 3372

Financial Performance

In 2024, Taiwan IC Packaging's revenue was 904.16 million, an increase of 4.93% compared to the previous year's 861.69 million. Losses were -185.38 million, 4.74% more than in 2023.