Taiwan IC Packaging Company Description

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies.

The company’s products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages.

It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. The company was founded in 1998 and is headquartered in Kaohsiung, Taiwan.

Taiwan IC Packaging Corporation

Country	Taiwan
Founded	1998
Industry	Semiconductors
Sector	Technology
Employees	392
CEO	Chung-Ho Tseng

Contact Details

Address: Kaohsiung Export Processing Zone Kaohsiung Taiwan
Phone	886 7 815 8800
Website	ticp.com.tw

Stock Details

Ticker Symbol	3372
Exchange	Taipei Exchange
Fiscal Year	January - December
Reporting Currency	TWD
ISIN Number	TW0003372009
SIC Code	3674

Key Executives

Name	Position
Chung-Ho Tseng	President
Zhuo Jian Bin	Head of Accounting Department and Associate of Finance Department
Su Jun Ren	Vice President of Operations
Guo Yuan Ping	Vice President of Sales
Shu Chong Zheng	Executive Director