Taiwan IC Packaging Corporation (TPEX:3372)
23.00
-0.70 (-2.95%)
Jan 22, 2026, 1:10 PM CST
Taiwan IC Packaging Company Description
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally.
The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages.
It also provides substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is headquartered in Kaohsiung, Taiwan.
Taiwan IC Packaging Corporation
| Country | Taiwan |
| Founded | 1998 |
| Industry | Semiconductors |
| Sector | Technology |
| Employees | 435 |
| CEO | Chung-Ho Tseng |
Contact Details
Address: No. 1, South 2nd Road Kaohsiung Taiwan | |
| Phone | 886 7 815 8800 |
| Website | ticp.com.tw |
Stock Details
| Ticker Symbol | 3372 |
| Exchange | Taipei Exchange |
| Stock Type | Common Stock |
| Fiscal Year | January - December |
| Reporting Currency | TWD |
| ISIN Number | TW0003372009 |
| SIC Code | 3674 |
Key Executives
| Name | Position |
|---|---|
| Chung-Ho Tseng | President |
| Zhuo Jian Bin | Accounting Supervisor and Associate of Finance Department |
| Su Jun Ren | Vice President of Operations |
| Guo Yuan Ping | Vice President of Sales |
| Shu Chong Zheng | Executive Director |