Taiwan IC Packaging Corporation (TPEX:3372)
17.60
+0.15 (0.86%)
Oct 31, 2025, 2:32 PM CST
Taiwan IC Packaging Company Description
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies.
The company’s products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages.
It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is headquartered in Kaohsiung, Taiwan.
Taiwan IC Packaging Corporation
| Country | Taiwan |
| Founded | 1998 |
| Industry | Semiconductors |
| Sector | Technology |
| Employees | 435 |
| CEO | Chung-Ho Tseng |
Contact Details
Address: Kaohsiung Export Processing Zone Kaohsiung Taiwan | |
| Phone | 886 7 815 8800 |
| Website | ticp.com.tw |
Stock Details
| Ticker Symbol | 3372 |
| Exchange | Taipei Exchange |
| Stock Type | Common Stock |
| Fiscal Year | January - December |
| Reporting Currency | TWD |
| ISIN Number | TW0003372009 |
| SIC Code | 3674 |
Key Executives
| Name | Position |
|---|---|
| Chung-Ho Tseng | President |
| Zhuo Jian Bin | Accounting Supervisor and Associate of Finance Department |
| Su Jun Ren | Vice President of Operations |
| Guo Yuan Ping | Vice President of Sales |
| Shu Chong Zheng | Executive Director |