Xintec Inc. (TPEX:3374)
Taiwan flag Taiwan · Delayed Price · Currency is TWD
143.50
+2.00 (1.41%)
Jul 23, 2025, 10:59 AM CST

Xintec Company Description

Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe.

The company offers wafer level chip scale packaging for image and environmental sensors; wafer level post passivation interconnection for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF components; and wafer testing services.

It also provides optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via RDL interconnect products, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and wafer reconstruction with a glass lid for automotive applications.

In addition, the company provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services.

Its products are used in tablets, notebooks, computers, and medical applications. Xintec Inc. was incorporated in 1998 and is headquartered in Taoyuan City, Taiwan.

Xintec Inc.
CountryTaiwan
Founded1998
IndustrySemiconductors
SectorTechnology
Employees1,408
CEOChia Hsiang Chen

Contact Details

Address:
No. 23, Jilin Road
Taoyuan City, 32062
Taiwan
Phone886 3 433 1818
Websitexintec.com.tw

Stock Details

Ticker Symbol3374
ExchangeTaipei Exchange
Stock TypeCommon Stock
Fiscal YearJanuary - December
Reporting CurrencyTWD
ISIN NumberTW0003374005
SIC Code3674

Key Executives

NamePosition
Chia Hsiang ChenChairman, GM and President
Shu Min LinChief Financial Officer and Vice President of Finance
H. K. LanAssociate Vice President of Operations
C. T. ChouHead of Department of Legal Affairs, Company Supervisor, Governance Officer and Company Secretary
J. W. MaAssociate Vice President of Sales and QR