Xintec Company Description

Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe.

The company provides wafer level chip scale packaging, wafer-level back cover packaging, and testing services for semiconductors.

It also offers optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via XinTSV, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and specialty RW service with a glass lid for automotive applications.

In addition, the company provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services.

Xintec Inc. was founded in 1987 and is headquartered in Taoyuan City, Taiwan.

Xintec Inc.

Country	Taiwan
Founded	1987
Industry	Semiconductors
Sector	Technology
Employees	1,408
CEO	Chia Hsiang Chen

Contact Details

Address: No. 23, Jilin Road Taoyuan City, 32062 Taiwan
Phone	886 3 433 1818
Website	xintec.com.tw

Stock Details

Ticker Symbol	3374
Exchange	Taipei Exchange
Stock Type	Common Stock
Fiscal Year	January - December
Reporting Currency	TWD
ISIN Number	TW0003374005
SIC Code	3674

Key Executives

Name	Position
Chia Hsiang Chen	Chairman, GM and President
Shu Min Lin	Chief Financial Officer and Vice President of Finance
H. K. Lan	Associate Vice President of Operations
C. T. Chou	Head of Department of Legal Affairs, Company Supervisor, Governance Officer and Company Secretary
J. W. Ma	Associate Vice President of Sales and QR