Chipbond Technology Corporation (TPEX:6147)

Market Cap	40.14B
Revenue (ttm)	21.20B
Net Income (ttm)	3.58B
Shares Out	744.63M
EPS (ttm)	4.73
PE Ratio	11.39
Forward PE	10.62
Dividend	3.75 (6.96%)
Ex-Dividend Date	Jun 17, 2025

Volume	3,385,991
Average Volume	3,646,102
Open	54.20
Previous Close	53.90
Day's Range	54.10 - 55.00
52-Week Range	53.00 - 68.90
Beta	0.23
RSI	43.04
Earnings Date	Jul 25, 2025

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip ...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2024, Chipbond Technology's revenue was 20.34 billion, an increase of 1.40% compared to the previous year's 20.06 billion. Earnings were 4.13 billion, an increase of 3.50%.