Chipbond Technology Corporation (TPEX: 6147)

Market Cap	47.36B
Revenue (ttm)	19.79B
Net Income (ttm)	3.96B
Shares Out	744.68M
EPS (ttm)	5.27
PE Ratio	12.07
Forward PE	12.07
Dividend	3.75 (5.91%)
Ex-Dividend Date	May 23, 2024

Volume	918,316
Average Volume	2,156,224
Open	62.90
Previous Close	62.70
Day's Range	62.90 - 63.50
52-Week Range	59.50 - 80.80
Beta	0.51
RSI	51.31
Earnings Date	Feb 21, 2025

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip ...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2023, Chipbond Technology's revenue was 20.06 billion, a decrease of -16.47% compared to the previous year's 24.01 billion. Earnings were 3.99 billion, a decrease of -35.66%.