Chipbond Technology Corporation (TPEX:6147)

Market Cap	44.83B
Revenue (ttm)	20.34B
Net Income (ttm)	4.13B
Shares Out	744.68M
EPS (ttm)	5.49
PE Ratio	10.97
Forward PE	10.93
Dividend	3.75 (6.38%)
Ex-Dividend Date	May 23, 2024

Volume	1,242,993
Average Volume	2,642,110
Open	60.30
Previous Close	60.20
Day's Range	59.70 - 60.60
52-Week Range	53.20 - 79.90
Beta	0.39
RSI	45.73
Earnings Date	Apr 30, 2025

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip ...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2024, Chipbond Technology's revenue was 20.34 billion, an increase of 1.40% compared to the previous year's 20.06 billion. Earnings were 4.13 billion, an increase of 3.50%.