Chipbond Technology Corporation (TPEX: 6147)

Market Cap	48.03B
Revenue (ttm)	19.42B
Net Income (ttm)	4.14B
Shares Out	744.68M
EPS (ttm)	5.52
PE Ratio	11.69
Forward PE	12.64
Dividend	3.75 (5.68%)
Ex-Dividend Date	May 23, 2024

Volume	474,227
Open	65.10
Previous Close	64.50
Day's Range	64.50 - 65.10
52-Week Range	59.50 - 80.80
Beta	0.55
Analysts	n/a
Price Target	n/a
Earnings Date	Oct 25, 2024

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip ...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2023, Chipbond Technology's revenue was 20.06 billion, a decrease of -16.47% compared to the previous year's 24.01 billion. Earnings were 3.99 billion, a decrease of -35.66%.