Chipbond Technology Corporation (TPEX:6147)

Market Cap	40.14B
Revenue (ttm)	21.41B
Net Income (ttm)	2.87B
Shares Out	744.63M
EPS (ttm)	3.80
PE Ratio	14.18
Forward PE	11.69
Dividend	3.75 (6.96%)
Ex-Dividend Date	Jun 17, 2025

Volume	5,082,959
Average Volume	1,815,891
Open	53.00
Previous Close	52.90
Day's Range	53.00 - 54.60
52-Week Range	50.60 - 67.40
Beta	0.37
RSI	55.80
Earnings Date	Feb 11, 2026

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip ...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2024, Chipbond Technology's revenue was 20.34 billion, an increase of 1.40% compared to the previous year's 20.06 billion. Earnings were 4.13 billion, an increase of 3.50%.