Chipbond Technology Corporation (TPEX:6147)

Market Cap	42.97B
Revenue (ttm)	21.41B
Net Income (ttm)	2.87B
Shares Out	744.63M
EPS (ttm)	3.80
PE Ratio	15.18
Forward PE	13.29
Dividend	3.75 (6.30%)
Ex-Dividend Date	Jun 17, 2025

Volume	54,000
Average Volume	4,206,105
Open	58.80
Previous Close	57.70
Day's Range	58.00 - 58.80
52-Week Range	50.60 - 67.40
Beta	0.36
RSI	60.92
Earnings Date	Feb 11, 2026

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip ...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2024, Chipbond Technology's revenue was 20.34 billion, an increase of 1.40% compared to the previous year's 20.06 billion. Earnings were 4.13 billion, an increase of 3.50%.