Chipbond Technology Corporation (TPEX:6147)

Market Cap	57.93B +18.8%
Revenue (ttm)	21.45B +5.5%
Net Income	2.78B -32.9%
EPS	3.68 -33.0%
Shares Out	744.63M
PE Ratio	21.16
Forward PE	17.98
Dividend	2.80 (3.95%)
Ex-Dividend Date	Jun 17, 2025

Volume	54,287,406
Average Volume	19,156,340
Open	73.50
Previous Close	70.80
Day's Range	73.10 - 77.80
52-Week Range	50.20 - 77.80
Beta	0.36
RSI	73.03
Earnings Date	Apr 30, 2026

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chi...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2025, Chipbond Technology's revenue was 21.45 billion, an increase of 5.49% compared to the previous year's 20.34 billion. Earnings were 2.78 billion, a decrease of -32.88%.