Chipbond Technology Corporation (TPEX:6147)

Market Cap	39.24B -17.3%
Revenue (ttm)	21.45B +5.5%
Net Income	2.78B -32.9%
EPS	3.68 -32.9%
Shares Out	744.63M
PE Ratio	14.32
Forward PE	12.19
Dividend	3.75 (7.14%)
Ex-Dividend Date	Jun 17, 2025

Volume	1,372,332
Average Volume	2,691,471
Open	52.20
Previous Close	52.50
Day's Range	51.90 - 52.90
52-Week Range	50.60 - 67.30
Beta	0.36
RSI	42.28
Earnings Date	Feb 11, 2026

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip ...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2025, Chipbond Technology's revenue was 21.45 billion, an increase of 5.49% compared to the previous year's 20.34 billion. Earnings were 2.78 billion, a decrease of -32.88%.