Chipbond Technology Corporation (TPEX:6147)

Market Cap	43.11B
Revenue (ttm)	21.42B
Net Income (ttm)	2.98B
Shares Out	744.63M
EPS (ttm)	3.95
PE Ratio	14.66
Forward PE	12.34
Dividend	3.75 (6.48%)
Ex-Dividend Date	Jun 17, 2025

Volume	5,435,266
Average Volume	2,524,346
Open	56.40
Previous Close	55.90
Day's Range	56.30 - 58.30
52-Week Range	51.80 - 67.40
Beta	0.32
RSI	70.75
Earnings Date	Oct 30, 2025

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip ...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2024, Chipbond Technology's revenue was 20.34 billion, an increase of 1.40% compared to the previous year's 20.06 billion. Earnings were 4.13 billion, an increase of 3.50%.