Chipbond Technology Corporation (TPEX:6147)
Taiwan · Delayed Price · Currency is TWD 229.50
+2.00 (0.88%)
Jun 17, 2026, 1:30 PM CST
Chipbond Technology Dividend Information
Chipbond Technology has an annual dividend of 2.80 TWD per share, with a yield of 1.19%. The dividend is paid once per year and the last ex-dividend date was Jun 17, 2026.
Dividend Yield
1.19%
Annual Dividend
2.80 TWD
Ex-Dividend Date
Jun 17, 2026
Payout Frequency
Annual
Payout Ratio
109.76%
Dividend Growth(1Y)
-25.34%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 17, 2026 | 2.800 TWD | Jul 15, 2026 |
| Jun 17, 2025 | 3.75021 TWD | Jul 15, 2025 |
| May 23, 2024 | 3.750 TWD | Jun 14, 2024 |
| Jun 16, 2023 | 5.500 TWD | Jul 14, 2023 |
| Jul 20, 2022 | 6.000 TWD | Aug 12, 2022 |
| Jul 21, 2021 | 3.800 TWD | Aug 13, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.