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Chipbond Technology Corporation (TPEX:6147)
Taiwan flag Taiwan · Delayed Price · Currency is TWD
158.50
-5.00 (-3.06%)
Aug 19, 2026, 10:28 AM CST

Chipbond Technology Dividend Information

Chipbond Technology has an annual dividend of 2.80 TWD per share, with a yield of 1.66%. The dividend is paid once per year and the last ex-dividend date was Jun 17, 2026.

Dividend Yield
1.66%
Annual Dividend
2.80 TWD
Ex-Dividend Date
Jun 17, 2026
Payout Frequency
Annual
Payout Ratio
90.55%
Dividend Growth
-25.34%

Dividend History

Ex-Div Date AmountRecord DatePay Date
Jun 17, 20262.800 TWDJun 18, 2026Jul 15, 2026
Jun 17, 20253.75021 TWDJun 18, 2025Jul 15, 2025
May 23, 20243.750 TWDMay 24, 2024Jun 14, 2024
Jun 16, 20235.500 TWDJun 19, 2023Jul 14, 2023
Jul 20, 20226.000 TWDJul 21, 2022Aug 12, 2022
Jul 21, 20213.800 TWDJul 22, 2021Aug 13, 2021
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts