Chipbond Technology Corporation (TPEX:6147)

Market Cap	84.88B +71.9%
Revenue (ttm)	21.45B +5.5%
Net Income	2.78B -32.9%
EPS	3.68 -33.0%
Shares Out	744.59M
PE Ratio	31.01
Forward PE	24.85
Dividend	2.80 (2.64%)
Ex-Dividend Date	Jun 17, 2025

Volume	23,180,295
Average Volume	40,613,576
Open	116.50
Previous Close	114.00
Day's Range	115.00 - 125.00
52-Week Range	50.20 - 125.00
Beta	0.10
RSI	75.48
Earnings Date	Apr 30, 2026

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chi...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2025, Chipbond Technology's revenue was 21.45 billion, an increase of 5.49% compared to the previous year's 20.34 billion. Earnings were 2.78 billion, a decrease of -32.88%.