Chipbond Technology Corporation (TPEX:6147)

Taiwan · Delayed Price · Currency is TWD

160.00

-3.50 (-2.14%)

Aug 19, 2026, 9:49 AM CST

197.95% (1Y)

Market Cap	121.74B +204.5%
Revenue (ttm)	23.33B +8.9%
Net Income	3.08B +3.4%
EPS	4.08 +3.2%
Shares Out	744.59M
PE Ratio	40.12
Forward PE	23.78
Dividend	2.80 (1.66%)
Ex-Dividend Date	Jun 17, 2026

Volume	479,000
Open	157.00
Previous Close	163.50
Day's Range	157.00 - 162.00
52-Week Range	50.20 - 313.50
Beta	1.84
Analysts	Buy
Price Target	230.67 (+44.17%)
Earnings Date	Oct 30, 2026

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chi... [Read more]

Industry Semiconductor Equipment & Materials

Sector Technology

Founded 1997

Employees 3,757

Stock Exchange Taipei Exchange

Ticker Symbol 6147

Full Company Profile

Financial Performance

In 2025, Chipbond Technology's revenue was 21.45 billion, an increase of 5.49% compared to the previous year's 20.34 billion. Earnings were 2.78 billion, a decrease of -32.88%.

Financial Statements

Analyst Summary

According to 6 analysts, the average rating for 6147 stock is "Buy." The 12-month stock price target is $230.67, which is an increase of 44.17% from the latest price.

Price Target

$230.67

(44.17% upside)

Analyst Consensus: Buy

Stock Forecasts