Chipbond Technology Corporation (TPEX:6147)

Market Cap	197.32B +317.9%
Revenue (ttm)	22.07B +4.1%
Net Income	2.54B -28.8%
EPS	3.41 -28.0%
Shares Out	744.59M
PE Ratio	77.79
Forward PE	42.90
Dividend	2.80 (1.07%)
Ex-Dividend Date	Jun 17, 2025

Volume	81,840,976
Open	272.00
Previous Close	260.50
Day's Range	258.00 - 281.00
52-Week Range	50.20 - 274.50
Beta	1.25
Analysts	Buy
Price Target	189.00 (-28.68%)
Earnings Date	Jul 30, 2026

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chi...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2025, Chipbond Technology's revenue was 21.45 billion, an increase of 5.49% compared to the previous year's 20.34 billion. Earnings were 2.78 billion, a decrease of -32.88%.