Chipbond Technology Corporation (TPEX:6147)

Market Cap	143.33B +257.8%
Revenue (ttm)	22.07B +4.1%
Net Income	2.54B -28.8%
EPS	3.41 -28.0%
Shares Out	744.59M
PE Ratio	56.51
Forward PE	31.27
Dividend	2.80 (1.60%)
Ex-Dividend Date	Jun 17, 2025

Volume	35,858,858
Average Volume	39,155,580
Open	187.50
Previous Close	175.00
Day's Range	185.00 - 192.50
52-Week Range	50.20 - 193.50
Beta	1.25
RSI	79.68
Earnings Date	May 8, 2026

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chi...

• Industry: Semiconductor Equipment & Materials
• Sector: Technology
• Founded: 1997
• Employees: 3,757
• Stock Exchange: Taipei Exchange
• Ticker Symbol: 6147

Financial Performance

In 2025, Chipbond Technology's revenue was 21.45 billion, an increase of 5.49% compared to the previous year's 20.34 billion. Earnings were 2.78 billion, a decrease of -32.88%.