Chipbond Technology Corporation (TPEX:6147)

Taiwan · Delayed Price · Currency is TWD

217.00

+17.50 (8.77%)

Jul 9, 2026, 1:30 PM CST

305.61% (1Y)

Market Cap	148.55B +222.8%
Revenue (ttm)	22.07B +4.1%
Net Income	2.54B -28.8%
EPS	3.36 -29.0%
Shares Out	744.59M
PE Ratio	59.37
Forward PE	32.74
Dividend	2.80 (1.40%)
Ex-Dividend Date	Jun 17, 2026

Volume	25,311,086
Open	201.50
Previous Close	199.50
Day's Range	198.50 - 219.00
52-Week Range	50.20 - 313.50
Beta	1.69
Analysts	Buy
Price Target	235.67 (+8.6%)
Earnings Date	Jul 30, 2026

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chi... [Read more]

Industry Semiconductor Equipment & Materials

Sector Technology

Founded 1997

Employees 3,757

Stock Exchange Taipei Exchange

Ticker Symbol 6147

Full Company Profile

Financial Performance

In 2025, Chipbond Technology's revenue was 21.45 billion, an increase of 5.49% compared to the previous year's 20.34 billion. Earnings were 2.78 billion, a decrease of -32.88%.

Financial Statements

Analyst Summary

According to 6 analysts, the average rating for 6147 stock is "Buy." The 12-month stock price target is $235.67, which is an increase of 8.60% from the latest price.

Price Target

$235.67

(8.60% upside)

Analyst Consensus: Buy

Stock Forecasts