Chipbond Technology Corporation (TPEX: 6147)
64.70
+0.20 (0.31%)
Sep 11, 2024, 10:43 AM CST
Chipbond Technology Dividend Information
Chipbond Technology has an annual dividend of 3.75 TWD per share, with a yield of 5.68%. The dividend is paid once per year and the last ex-dividend date was May 23, 2024.
Dividend Yield
5.68%
Annual Dividend
3.75 TWD
Ex-Dividend Date
May 23, 2024
Payout Frequency
Annual
Payout Ratio
165.74%
Dividend Growth(1Y)
n/a
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
May 23, 2024 | 3.750 TWD | Jun 14, 2024 |
Jun 16, 2023 | 5.500 TWD | Jul 14, 2023 |
Jul 20, 2022 | 6.000 TWD | Aug 12, 2022 |
Jul 21, 2021 | 3.800 TWD | Aug 13, 2021 |
Jul 23, 2020 | 4.200 TWD | Aug 14, 2020 |
* Dividend amounts are adjusted for stock splits when applicable.