Chipbond Technology Corporation (TPEX:6147)
Taiwan · Delayed Price · Currency is TWD 59.60
+1.40 (2.41%)
Oct 31, 2025, 2:32 PM CST
Chipbond Technology Dividend Information
Chipbond Technology has an annual dividend of 3.75 TWD per share, with a yield of 6.29%. The dividend is paid once per year and the last ex-dividend date was Jun 17, 2025.
Dividend Yield
6.29%
Annual Dividend
3.75 TWD
Ex-Dividend Date
Jun 17, 2025
Payout Frequency
Annual
Payout Ratio
97.30%
Dividend Growth(1Y)
0.01%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 17, 2025 | 3.75021 TWD | Jul 15, 2025 |
| May 23, 2024 | 3.750 TWD | Jun 14, 2024 |
| Jun 16, 2023 | 5.500 TWD | Jul 14, 2023 |
| Jul 20, 2022 | 6.000 TWD | Aug 12, 2022 |
| Jul 21, 2021 | 3.800 TWD | Aug 13, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.