Chipbond Technology Corporation (TPEX: 6147)
Taiwan
· Delayed Price · Currency is TWD
64.90
-0.70 (-1.07%)
Dec 19, 2024, 1:30 PM CST
Chipbond Technology Dividend Information
Dividend Yield
5.79%
Annual Dividend
3.75 TWD
Ex-Dividend Date
n/a
Payout Frequency
Annual
Payout Ratio
70.51%
Dividend Growth(1Y)
-31.82%
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
May 23, 2024 | 3.750 TWD | Jun 14, 2024 |
Jun 16, 2023 | 5.500 TWD | Jul 14, 2023 |
Jul 20, 2022 | 6.000 TWD | Aug 12, 2022 |
Jul 21, 2021 | 3.800 TWD | Aug 13, 2021 |
Jul 23, 2020 | 4.200 TWD | Aug 14, 2020 |
* Dividend amounts are adjusted for stock splits when applicable.