Honor Seiki Co., Ltd (TPEX:7709)
59.10
-5.90 (-9.08%)
At close: Feb 11, 2026
Honor Seiki Dividend Information
Honor Seiki has an annual dividend of 2.30 TWD per share, with a yield of 3.37%. The dividend is paid once per year and the last ex-dividend date was Jun 26, 2025.
Dividend Yield
3.37%
Annual Dividend
2.30 TWD
Ex-Dividend Date
Jun 26, 2025
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 26, 2025 | 2.300 TWD | Jul 24, 2025 |
| Jun 12, 2024 | 2.000 TWD | Jul 5, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.