Honor Seiki Co., Ltd (TPEX:7709)
39.60
-0.10 (-0.25%)
Jul 22, 2025, 1:15 PM CST
Honor Seiki Dividend Information
Honor Seiki has an annual dividend of 2.30 TWD per share, with a yield of 5.81%. The dividend is paid once per year and the last ex-dividend date was Jun 26, 2025.
Dividend Yield
5.81%
Annual Dividend
2.30 TWD
Ex-Dividend Date
Jun 26, 2025
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
n/a
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Jun 26, 2025 | 2.300 TWD | Jul 24, 2025 |
Jun 12, 2024 | 2.000 TWD | Jul 5, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.