Honor Seiki Co., Ltd. (TPEX:7709)
87.60
+2.30 (2.70%)
Oct 5, 2026, 1:30 PM CST
Honor Seiki Dividend Information
Honor Seiki has an annual dividend of 1.50 TWD per share, with a yield of 1.71%. The dividend is paid once per year and the last ex-dividend date was Jun 17, 2026.
Dividend Yield
1.71%
Annual Dividend
1.50 TWD
Ex-Dividend Date
Jun 17, 2026
Payout Frequency
Annual
Payout Ratio
61.47%
Dividend Growth(1Y)
-34.78%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.