Honor Seiki Co., Ltd. (TPEX:7709)
110.50
+10.00 (9.95%)
May 29, 2026, 1:24 PM CST
Honor Seiki Dividend Information
Honor Seiki has an annual dividend of 1.50 TWD per share, with a yield of 1.36%. The dividend is paid once per year and the next ex-dividend date is Jun 17, 2026.
Dividend Yield
1.36%
Annual Dividend
1.50 TWD
Ex-Dividend Date
Jun 17, 2026
Payout Frequency
Annual
Payout Ratio
94.37%
Dividend Growth(1Y)
-34.78%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 17, 2026 | 1.500 TWD | Jul 16, 2026 |
| Jun 26, 2025 | 2.300 TWD | Jul 24, 2025 |
| Jun 12, 2024 | 2.000 TWD | Jul 5, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.