Honor Seiki Co., Ltd. (TPEX:7709)
70.80
+1.40 (2.02%)
Aug 21, 2026, 12:55 PM CST
Honor Seiki Dividend Information
Honor Seiki has an annual dividend of 1.50 TWD per share, with a yield of 2.11%. The dividend is paid once per year and the last ex-dividend date was Jun 17, 2026.
Dividend Yield
2.11%
Annual Dividend
1.50 TWD
Ex-Dividend Date
Jun 17, 2026
Payout Frequency
Annual
Payout Ratio
61.47%
Dividend Growth(1Y)
-34.78%
* Dividend amounts are adjusted for stock splits when applicable.