HPC SYSTEMS Inc. (TYO:6597)
Japan · Delayed Price · Currency is JPY 1,850.00
+118.00 (6.81%)
Mar 5, 2026, 3:30 PM JST
HPC SYSTEMS Dividend Information
HPC SYSTEMS has an annual dividend of 32.00 JPY per share, with a yield of 1.73%. The dividend is paid once per year and the next ex-dividend date is Jun 29, 2026.
Dividend Yield
1.73%
Annual Dividend
32.00 JPY
Ex-Dividend Date
Jun 29, 2026
Payout Frequency
Annual
Payout Ratio
22.26%
Dividend Growth(1Y)
14.29%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 29, 2026 | 32.000 JPY | Sep 30, 2026 |
| Jun 27, 2025 | 28.000 JPY | Sep 30, 2025 |
| Jun 27, 2024 | 25.000 JPY | Sep 30, 2024 |
| Jun 29, 2023 | 25.000 JPY | Sep 29, 2023 |
| Jun 29, 2022 | 25.000 JPY | Sep 30, 2022 |
* Dividend amounts are adjusted for stock splits when applicable.