HPC SYSTEMS Inc. (TYO:6597)
1,129.00
-4.00 (-0.35%)
Apr 24, 2025, 3:30 PM JST
HPC SYSTEMS Dividend Information
HPC SYSTEMS has an annual dividend of 26.00 JPY per share, with a yield of 2.29%. The dividend is paid once per year and the next ex-dividend date is Jun 27, 2025.
Dividend Yield
2.29%
Annual Dividend
26.00 JPY
Ex-Dividend Date
Jun 27, 2025
Payout Frequency
Annual
Payout Ratio
30.57%
Dividend Growth(1Y)
4.00%
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Jun 27, 2025 | 26.000 JPY | Sep 30, 2025 |
Jun 27, 2024 | 25.000 JPY | Sep 30, 2024 |
Jun 29, 2023 | 25.000 JPY | Sep 29, 2023 |
Jun 29, 2022 | 25.000 JPY | Sep 30, 2022 |
* Dividend amounts are adjusted for stock splits when applicable.