HPC SYSTEMS Inc. (TYO:6597)
2,004.00
+9.00 (0.45%)
Aug 29, 2025, 3:30 PM JST
HPC SYSTEMS Dividend Information
HPC SYSTEMS has an annual dividend of 32.00 JPY per share, with a yield of 1.60%. The dividend is paid once per year and the last ex-dividend date was Jun 27, 2025.
Dividend Yield
1.60%
Annual Dividend
32.00 JPY
Ex-Dividend Date
Jun 27, 2025
Payout Frequency
Annual
Payout Ratio
25.30%
Dividend Growth(1Y)
12.00%
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Jun 27, 2025 | 28.000 JPY | Sep 30, 2025 |
Jun 27, 2024 | 25.000 JPY | Sep 30, 2024 |
Jun 29, 2023 | 25.000 JPY | Sep 29, 2023 |
Jun 29, 2022 | 25.000 JPY | Sep 30, 2022 |
* Dividend amounts are adjusted for stock splits when applicable.