HPC SYSTEMS Inc. (TYO:6597)
3,915.00
+130.00 (3.43%)
Jul 10, 2026, 3:30 PM JST
HPC SYSTEMS Dividend Information
HPC SYSTEMS has an annual dividend of 32.00 JPY per share, with a yield of 0.85%. The dividend is paid once per year and the last ex-dividend date was Jun 29, 2026.
Dividend Yield
0.85%
Annual Dividend
32.00 JPY
Ex-Dividend Date
Jun 29, 2026
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
14.29%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 29, 2026 | 32.000 JPY | Sep 30, 2026 |
| Jun 27, 2025 | 28.000 JPY | Sep 30, 2025 |
| Jun 27, 2024 | 25.000 JPY | Sep 30, 2024 |
| Jun 29, 2023 | 25.000 JPY | Sep 29, 2023 |
| Jun 29, 2022 | 25.000 JPY | Sep 30, 2022 |
* Dividend amounts are adjusted for stock splits when applicable.