Seika Corporation (TYO:8061)
3,030.00
+80.00 (2.71%)
Oct 16, 2026, 3:30 PM JST
Seika Dividend Information
Seika has an annual dividend of 105.00 JPY per share, with a yield of 3.47%. The dividend is paid every six months and the last ex-dividend date was Sep 29, 2026.
Dividend Yield
3.47%
Annual Dividend
105.00 JPY
Ex-Dividend Date
Sep 29, 2026
Payout Frequency
Semi-Annual
Payout Ratio
38.98%
Dividend Growth(1Y)
-40.65%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.