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ASE Technology Holding Company, Ltd. (ASX)

Stock Price: $5.23 USD -0.08 (-1.51%)
Updated November 24, 4:00 PM EST - Market closed
Pre-market: $5.19 -0.04 (-0.77%) Nov 25, 8:38 AM

Stock Price Chart

Key Info

Market Cap 11.15B
Revenue (ttm) 13.73B
Net Income (ttm) 606.93M
Shares Out 2.13B
EPS (ttm) 0.31
PE Ratio 16.87
Forward PE 11.40
Dividend $0.14
Dividend Yield 2.68%

Stock Quote

Trading Day November 24
Last Price $5.23
Previous Close $5.31
Change ($) -0.08
Change (%) -1.51%
Day's Open 5.33
Day's Range 5.18 - 5.33
Day's Volume 820,283
52-Week Range 3.17 - 5.70

More Stats

Market Cap 11.15B
Enterprise Value 16.36B
Earnings Date (est) n/a
Ex-Dividend Date Aug 13, 2020
Shares Outstanding 2.13B
Float n/a
EPS (basic) n/a
EPS (diluted) 0.31
FCF / Share 3.15
Dividend $0.14
Dividend Yield 2.68%
Earnings Yield 5.93%
FCF Yield 24.38%
Payout Ratio 16.10%
Shares Short 525,338
Short Ratio 0.97
Short % of Float n/a
Beta 1.22
PE Ratio 16.87
Forward PE 11.40
P/FCF Ratio 4.10
PS Ratio 0.81
PB Ratio 1.53
Revenue 13.73B
Operating Income 772.69M
Net Income 606.93M
Free Cash Flow 2.72B
Net Cash -5.21B
Net Cash / Share -2.44
Gross Margin 15.56%
Operating Margin 5.63%
Profit Margin 4.40%
FCF Margin 19.81%
ROA 3.53%
ROE 11.61%
ROIC 5.90%
Key stats in USD, based on trailing-twelve-month (ttm) numbers.

Analyst Forecasts

Analyst Ratings (22)

Buy 15
Overweight 5
Hold 2
Underweight 0
Sell 0

Analyst Consensus: Buy

Price Target

$5.71*
(9.18% upside)
Low
5.03
Current: $5.23
High
6.99
Target: 5.71
*Average 12-month USD price target from 21 stock analysts.

Financial Performance

Financial numbers in millions TWD.

Financial Overview

Year2019201820172016201520142013201220112010
Revenue413,182371,092290,441274,884283,303256,591219,862193,972185,347188,743
Revenue Growth11.34%27.77%5.66%-2.97%10.41%16.71%13.35%4.65%-1.8%-
Gross Profit64,31161,16352,73253,18750,13553,58942,82236,63035,00940,545
Operating Income23,25827,01925,32725,86024,63329,87420,71317,70716,82124,099
Net Income18,26927,42424,49721,32419,73222,22915,40513,64813,72618,338
Shares Outstanding4,3228,7408,2747,9187,8667,8107,6086,6556,655-
Earnings Per Share19.5530.3525.9523.3012.4013.959.958.658.9011.95
EPS Growth-35.58%16.96%11.37%87.9%-11.11%40.2%15.03%-2.81%-25.52%-
Dividend Per Share0.11-0.160.250.320.220.350.100.100.05
Dividend Growth---34.66%-22.29%48.85%-38.35%270.53%-5.94%98.04%-
Operating Cash Flow81,87260,31851,91555,11863,04745,86341,29633,03831,93736,965
Capital Expenditures-----30,528-39,574-29,104-38,986-28,126-33,848
Free Cash Flow81,87260,31851,91555,11832,5196,28912,192-5,9483,8113,117
Cash & Equivalents65,02465,32051,86342,28859,41758,85550,44624,48325,31524,931
Total Debt221,722198,18477,189111,071119,96199,382100,78984,64076,52773,075
Net Cash / Debt-156,698-132,864-25,327-68,783-60,544-40,526-50,343-60,157-51,212-48,144
Assets557,224534,062363,922357,931364,987333,719286,722247,723224,962208,140
Liabilities344,421315,034162,612191,089199,062178,027160,978137,902125,171116,300
Book Value199,427201,388188,120154,841154,432147,482121,616106,31598,27891,839
Numbers in millions TWD, except per-share numbers.

Company Profile

Company Details

Full Name ASE Technology Holding Company, Ltd.
Country Taiwan
Employees 97,259
CEO Chien Shen Chang

Stock Information

Ticker Symbol ASX
Stock Exchange New York Stock Exchange
Sector Technology
Industry Semiconductors
Unique Identifier NYSE: ASX
IPO Date December 15, 1995

Description

ASE Technology Holding Company provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip chip ball grid array (BGA), flip chip chip scale package (CSP), advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper and silver wire bonding solutions, as well as module-based solutions. It also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer level packaging; SESUB; and substrate interposer packages. In addition, the company offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, it provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, the company develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, financing, investment advisory, warehousing management, logistics, and after sales services; manufactures computer assistance systems and related peripherals, electronic components, communication peripherals, telecommunications equipment, motherboards, and car components; imports and exports various products and technology. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan.