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ASE Technology Holding Company, Ltd. (ASX)

Stock Price: $4.69 USD -0.04 (-0.85%)
Updated Aug 11, 2020 4:00 PM EDT - Market closed
After-hours: $4.70 +0.01 (0.21%) Aug 11, 7:32 PM

Stock Price Chart

Key Info

Market Cap 10.00B
Revenue (ttm) 14.04B
Net Income (ttm) 620.96M
Shares Out 2.13B
EPS (ttm) 0.31
PE Ratio 15.13
Forward PE 11.68
Dividend $0.16
Dividend Yield 3.41%

Stock Quote

Trading Day Aug 11, 2020
Last Price $4.69
Previous Close $4.73
Change ($) -0.04
Change (%) -0.85%
Day's Open 4.73
Day's Range 4.67 - 4.75
Day's Volume 493,658
52-Week Range 3.17 - 5.70

More Stats

Market Cap 10.00B
Enterprise Value 15.33B
Earnings Date (est) Oct 28, 2020
Ex-Dividend Date n/a
Shares Outstanding 2.13B
Float 1.08B
EPS (basic) n/a
EPS (diluted) 0.31
FCF / Share 3.22
Dividend $0.16
Dividend Yield 3.41%
Earnings Yield 6.61%
FCF Yield 27.82%
Payout Ratio n/a
Shares Short 516,902
Short Ratio 0.58
Short % of Float n/a
Beta 1.26
PE Ratio 15.13
Forward PE 11.68
P/FCF Ratio 3.59
PS Ratio 0.71
PB Ratio 1.49
Revenue 14.04B
Operating Income 790.55M
Net Income 620.96M
Free Cash Flow 2.78B
Net Cash -5.33B
Net Cash / Share -2.50
Gross Margin 15.56%
Operating Margin 5.63%
Profit Margin 4.40%
FCF Margin 19.81%
ROA 3.61%
ROE 11.27%
ROIC n/a
Key stats in USD, based on trailing-twelve-month (ttm) numbers.

Analyst Summary

Analyst Ratings (23)

Buy 12
Overweight 3
Hold 7
Underweight 0
Sell 1

Analyst Consensus: Buy

Price Target

$5.64*
(20.26% upside)
Low
4.37
Current: $4.69
High
6.80
Target: 5.64
*Average 12-month USD price target from 23 stock analysts.

Financial Performance

Financial numbers in millions TWD.

Financial Overview

Year2019201820172016201520142013201220112010
Revenue413,182371,092290,441274,884283,303256,591219,862193,972185,347188,743
Revenue Growth11.34%27.77%5.66%-2.97%10.41%16.71%13.35%4.65%-1.8%-
Gross Profit64,31161,16352,73253,18750,13553,58942,82236,63035,00940,545
Operating Income23,25827,01925,32725,86024,63329,87420,71317,70716,82124,099
Net Income18,26927,42424,49721,32419,73222,22915,40513,64813,72618,338
Shares Outstanding4,3228,7408,2747,9187,8667,8107,6086,6556,655-
Earnings Per Share19.5530.3525.9523.3012.4013.959.958.658.9011.95
EPS Growth-35.58%16.96%11.37%87.9%-11.11%40.2%15.03%-2.81%-25.52%-
Dividend Per Share0.11-0.160.250.320.220.350.100.100.05
Dividend Growth---34.66%-22.29%48.85%-38.35%270.53%-5.94%98.04%-
Operating Cash Flow81,87260,31851,91555,11863,04745,86341,29633,03831,93736,965
Capital Expenditures-----30,528-39,574-29,104-38,986-28,126-33,848
Free Cash Flow81,87260,31851,91555,11832,5196,28912,192-5,9483,8113,117
Cash & Equivalents65,02465,32051,86342,28859,41758,85550,44624,48325,31524,931
Total Debt221,722198,18477,189111,071119,96199,382100,78984,64076,52773,075
Net Cash / Debt-156,698-132,864-25,327-68,783-60,544-40,526-50,343-60,157-51,212-48,144
Assets557,224534,062363,922357,931364,987333,719286,722247,723224,962208,140
Liabilities344,421315,034162,612191,089199,062178,027160,978137,902125,171116,300
Book Value199,427201,388188,120154,841154,432147,482121,616106,31598,27891,839
Numbers in millions TWD, except per-share numbers.

Company Profile

Company Details

Full Name ASE Technology Holding Company, Ltd.
Country Taiwan
Employees 95,448
CEO Chien Shen Chang

Stock Information

Ticker Symbol ASX
Stock Exchange New York Stock Exchange
Sector Technology
Industry Semiconductors
Unique Identifier NYSE: ASX
IPO Date December 15, 1995

Description

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip chip ball grid array (BGA), flip chip chip scale package (CSP), advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper and silver wire bonding solutions, as well as module-based solutions. It also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer level packaging; SESUB; and substrate interposer packages. In addition, the company offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, it provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, the company develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, financing, investment advisory, warehousing management, logistics, and after sales services; manufactures computer assistance systems and related peripherals, electronic components, communication peripherals, telecommunications equipment, motherboards, and car components; imports and exports various products and technology. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan.