SEI High Yield Bond & Alternative Credit ETF (LEND)

Assets	$979.55M
Expense Ratio	0.65%
PE Ratio	n/a
Forward PE	n/a
Shares Out	40.66M
Dividend	$0.79 (3.30%)
Ex-Dividend Date	Nov 4, 2026
Payout Frequency	Monthly
Payout Ratio	n/a

Volume	53,519
Open	24.08
Previous Close	24.12
Day's Range	24.03 - 24.09
52-Week Low	23.95
52-Week High	25.29
Beta	n/a
Holdings	1457
Inception Date	May 18, 2026

About LEND

Fund Home Page

The SEI High Yield Bond & Alternative Credit ETF (LEND) is an exchange-traded fund that mostly invests in high-yield bonds. The fund combines an external multi-manager, high-yield bond allocation with an internally actively managed collateralized loan obligation sleeve. The ETF aims to provide diversified exposure across traditional and alternative credit markets LEND was launched on May 18, 2026 and is issued by SEI.

• Asset Class: Fixed Income
• Category: High Yield Bond
• Stock Exchange: Nasdaq
• Ticker Symbol: LEND
• ETF Provider: SEI

Dividend History

Ex-Dividend	Amount	Pay Date
Nov 4, 2026	$0.15351	Nov 5, 2026
Oct 5, 2026	$0.13428	Oct 6, 2026
Sep 3, 2026	$0.12064	Sep 4, 2026
Aug 5, 2026	$0.1412	Aug 6, 2026
Jul 6, 2026	$0.245	Jul 7, 2026

Performance

Data Sources: S&P Global Market Intelligence, CBOE, and more

Historical data is provided by S&P Global Market Intelligence. Real-time stock price data is provided by CBOE and 15-minute delayed consolidated tape pricing data is provided by Nasdaq UTP. Several fund data points are also provided by Finnhub.

Last checked:

Nov 6, 2026

Data Sources Report a data error