SEI High Yield Bond & Alternative Credit ETF (LEND)

LEND Dividend Information

LEND has a dividend yield of 0.97% and paid $0.25 per share in the past year. The last ex-dividend date was Jul 6, 2026.

• Dividend Yield: 0.97%
• Dividend (ttm): $0.25
• Ex-Dividend Date: Jul 6, 2026
• Payout Frequency: n/a
• Payout Ratio: n/a
• Dividend Growth: n/a

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
Jul 6, 2026	$0.245	Jul 6, 2026	Jul 7, 2026

* Dividend amounts are adjusted for stock splits when applicable.

Data Source: S&P Global Market Intelligence Last updated: Jul 6, 2026

Dividend data is provided by S&P Global Market Intelligence and updates within hours after each dividend announcement, which is every three months for this fund.

Update frequency:

Quarterly

Last checked:

Jul 20, 2026

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