Hong Kong · Delayed Price · Currency is HKD ASMPT Earnings Call Transcripts
Fiscal Year 2026
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Q1 2026 saw record bookings and strong revenue growth, fueled by AI-driven demand across advanced packaging, photonics, and SMT. Margins and profits improved sequentially, with Q2 guidance above consensus and continued structural growth expected in 2026.
Fiscal Year 2025
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Bookings and revenue grew strongly in 2025, driven by AI demand and TCB technology leadership. Gross margin declined slightly, but profitability improved, and the backlog is robust. Strategic divestments and transformation initiatives sharpen focus on Back-End Packaging.
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Q3 2025 saw strong AI-driven growth, with revenue up 9.5% year-on-year and robust bookings. TCB technology leadership and recurring orders in HBM4 and logic support a positive outlook, with Q4 revenue guidance above consensus and continued R&D investment.
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AI-driven demand fueled strong growth in Advanced Packaging and mainstream segments, with H1 revenue and bookings exceeding expectations and gross margin above 40%. Q3 guidance is above consensus, with AP and TCB tools expected to sustain momentum, while order flow remains volatile due to customer concentration.
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Q1 2025 revenue met guidance at $401.5M, with strong AP/TCB momentum and gross margin rebounding above 40%. SEMI segment led growth, while SMT bookings recovered. Tariff uncertainties cloud mainstream outlook, but AP demand for AI/HPC remains robust.
Fiscal Year 2024
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Advanced Packaging solutions drove growth in 2024, with AP revenue up 23% year on year and TCB solutions achieving record bookings. Group revenue declined 10% due to SMT weakness, but Semi segment grew. Outlook remains strong for AP, with continued R&D investment and cautious guidance for Q1 2025.
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Q3 2024 saw strong AP and TCB demand, especially for HBM, offsetting ongoing SMT softness. Revenue was flat sequentially, with improved margins and a major TCB order win. Outlook for Q4 is cautious, with AP growth expected to continue into 2025.
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Revenue and profit declined year-on-year, but advanced packaging and Semi bookings showed strong momentum, especially in TCB and photonics. SMT and automotive markets remain soft, while AP and Semi segments are expected to drive future growth.