JWIPC Technology Dividend Information

JWIPC Technology has an annual dividend of 0.08 CNY per share, with a yield of 0.14%. The last ex-dividend date was May 27, 2025.

Dividend Yield

0.14%

Annual Dividend

0.08 CNY

Ex-Dividend Date

May 27, 2025

Payout Frequency

n/a

Payout Ratio

37.23%

Dividend Growth

300.00%

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
May 27, 2025	0.080 CNY	May 26, 2025	May 27, 2025
Aug 27, 2024	0.080 CNY	Aug 26, 2024	Aug 27, 2024
May 27, 2024	0.040 CNY	May 24, 2024	May 27, 2024
May 29, 2023	0.040 CNY	May 26, 2023	May 29, 2023

* Dividend amounts are adjusted for stock splits when applicable.