JWIPC Technology Co., Ltd. (SHE:001339)
79.21
-8.80 (-10.00%)
Jul 17, 2026, 3:04 PM CST
JWIPC Technology Dividend Information
JWIPC Technology has an annual dividend of 0.023 CNY per share, with a yield of 0.03%. The dividend is paid once per year and the last ex-dividend date was Jun 29, 2026.
Dividend Yield
0.03%
Annual Dividend
0.023 CNY
Ex-Dividend Date
Jun 29, 2026
Payout Frequency
Annual
Payout Ratio
124.24%
Dividend Growth(1Y)
-75.63%
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 29, 2026 | 0.030 CNY | Jun 29, 2026 |
| May 27, 2025 | 0.06154 CNY | May 27, 2025 |
| Aug 27, 2024 | 0.06154 CNY | Aug 27, 2024 |
| May 27, 2024 | 0.03077 CNY | May 27, 2024 |
| May 29, 2023 | 0.03077 CNY | May 29, 2023 |
* Dividend amounts are adjusted for stock splits when applicable.