Tongfu Microelectronics Co.,Ltd (SHE:002156)

Revenue by Segment

Financials in millions CNY. Fiscal year is January - December.

Fiscal Year	FY 2025	FY 2024	FY 2023	FY 2023	FY 2022	FY 2020	FY 2019	FY 2018	FY 2017	FY 2016
Period Ending	Dec 31, 2025	Dec 31, 2024	Dec 31, 2023	Jan 1, 2023	Jan 1, 2022	Dec 31, 2020	Dec 31, 2019	Dec 31, 2018	Dec 31, 2017	Dec 31, 2016
Integrated Circuit Packaging Test	27.25B	22.92B	21.13B	21.43B	15.81B
Integrated Circuit Packaging Test Growth	18.89%	8.44%	-1.37%	35.52%	46.84%
Unallocated Other Business	673.86M	963.15M	1.13B	-	-
Unallocated Other Business Growth	-30.04%	-15.10%	-	-	-
Total	27.92B	23.88B	22.27B	21.43B	15.81B
Total Growth	16.92%	7.24%	3.92%	35.52%	46.84%

Revenue by Geography

Financials in millions CNY. Fiscal year is January - December.

Fiscal Year	FY 2025	FY 2024	FY 2023	FY 2023	FY 2022	FY 2020	FY 2019	FY 2018	FY 2017	FY 2016
Period Ending	Dec 31, 2025	Dec 31, 2024	Dec 31, 2023	Jan 1, 2023	Jan 1, 2022	Dec 31, 2020	Dec 31, 2019	Dec 31, 2018	Dec 31, 2017	Dec 31, 2016
China	12.10B	10.50B	8.07B	7.38B	6.43B
China Growth	15.28%	30.06%	9.36%	14.81%	145.53%
Inter-Segment Elimination	-4.90B	-4.59B	-5.00B	-4.24B	-3.62B
Overseas	20.71B	17.97B	19.20B	18.29B	13.00B
Overseas Growth	15.26%	-6.40%	4.99%	40.64%	28.26%
Total	27.92B	23.88B	22.27B	21.43B	15.81B
Total Growth	16.92%	7.24%	3.92%	35.52%	46.84%

Data Source: S&P Global Market Intelligence Last updated: Mar 31, 2026

Financial data is provided by S&P Global Market Intelligence and updates within hours after each earnings release, which is every three months for this company.

Update frequency:

Quarterly

Last checked:

Jun 23, 2026

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