Seiwa Chuo Holdings Corporation (TYO:7531)
1,710.00
+10.00 (0.59%)
Jul 17, 2025, 10:43 AM JST
Seiwa Chuo Holdings Dividend Information
Seiwa Chuo Holdings has an annual dividend of 15.00 JPY per share, with a yield of 0.88%. The dividend is paid once per year and the last ex-dividend date was Dec 27, 2024.
Dividend Yield
0.88%
Annual Dividend
15.00 JPY
Ex-Dividend Date
Dec 27, 2024
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
-33.33%
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Dec 27, 2024 | 10.000 JPY | Mar 31, 2025 |
Dec 28, 2023 | 15.000 JPY | Mar 29, 2024 |
Dec 29, 2022 | 30.000 JPY | Mar 30, 2023 |
Dec 29, 2021 | 42.000 JPY | Mar 31, 2022 |
Dec 29, 2020 | 15.000 JPY | Mar 31, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.