Seiwa Chuo Holdings Corporation (TYO:7531)
1,470.00
-19.00 (-1.28%)
Mar 26, 2026, 12:56 PM JST
Seiwa Chuo Holdings Dividend Information
Seiwa Chuo Holdings has an annual dividend of 20.00 JPY per share, with a yield of 1.34%. The dividend is paid once per year and the last ex-dividend date was Dec 29, 2025.
Dividend Yield
1.34%
Annual Dividend
20.00 JPY
Ex-Dividend Date
Dec 29, 2025
Payout Frequency
Annual
Payout Ratio
11.21%
Dividend Growth(1Y)
100.00%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Dec 29, 2025 | 20.000 JPY | Mar 27, 2026 |
| Dec 27, 2024 | 10.000 JPY | Mar 31, 2025 |
| Dec 28, 2023 | 15.000 JPY | Mar 29, 2024 |
| Dec 29, 2022 | 30.000 JPY | Mar 30, 2023 |
| Dec 29, 2021 | 42.000 JPY | Mar 31, 2022 |
| Dec 29, 2020 | 15.000 JPY | Mar 31, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.