Seiwa Chuo Holdings Corporation (TYO:7531)
1,311.00
-26.00 (-1.94%)
Oct 8, 2026, 10:13 AM JST
Seiwa Chuo Holdings Dividend Information
Seiwa Chuo Holdings has an annual dividend of 20.00 JPY per share, with a yield of 1.53%. The dividend is paid once per year and the next ex-dividend date is Dec 29, 2026.
Dividend Yield
1.53%
Annual Dividend
20.00 JPY
Ex-Dividend Date
Dec 29, 2026
Payout Frequency
Annual
Payout Ratio
21.25%
Dividend Growth(1Y)
25.00%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.