Seiwa Chuo Holdings Corporation (TYO:7531)
1,319.00
0.00 (0.00%)
Sep 15, 2026, 9:00 AM JST
Seiwa Chuo Holdings Dividend Information
Seiwa Chuo Holdings has an annual dividend of 20.00 JPY per share, with a yield of 1.54%. The dividend is paid once per year and the next ex-dividend date is Dec 29, 2026.
Dividend Yield
1.54%
Annual Dividend
20.00 JPY
Ex-Dividend Date
Dec 29, 2026
Payout Frequency
Annual
Payout Ratio
21.25%
Dividend Growth(1Y)
25.00%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.