SEI High Yield Bond & Alternative Credit ETF (LEND)

Assets	$1.02B
Expense Ratio	0.65%
PE Ratio	n/a
Shares Out	40.93M
Dividend (ttm)	$0.39
Dividend Yield	1.55%
Ex-Dividend Date	Aug 5, 2026
Payout Frequency	Monthly
Payout Ratio	n/a

Volume	87,900
Open	24.88
Previous Close	24.87
Day's Range	24.87 - 24.92
52-Week Low	24.79
52-Week High	25.29
Beta	n/a
Holdings	1412
Inception Date	May 18, 2026

About LEND

Fund Home Page

The SEI High Yield Bond & Alternative Credit ETF (LEND) is an exchange-traded fund that mostly invests in high yield fixed income. The fund combines an external multi-manager, high-yield bond allocation with an internally actively managed collateralized loan obligation sleeve. The ETF aims to provide diversified exposure across traditional and alternative credit markets LEND was launched on May 18, 2026 and is issued by SEI.

• Asset Class: Fixed Income
• Stock Exchange: NASDAQ
• Ticker Symbol: LEND
• ETF Provider: SEI

Dividend History

Ex-Dividend	Amount	Pay Date
Aug 5, 2026	$0.1412	Aug 6, 2026
Jul 6, 2026	$0.245	Jul 7, 2026

Performance

Data Sources: S&P Global Market Intelligence, CBOE, and more

Historical data is provided by S&P Global Market Intelligence. Real-time stock price data is provided by CBOE and 15-minute delayed consolidated tape pricing data is provided by Nasdaq UTP. Several fund data points are also provided by Finnhub.

Last checked:

Aug 25, 2026

Data Sources Report a data error