China Wafer Level CSP Co., Ltd. (SHA: 603005)

Market Cap	22.44B
Revenue (ttm)	1.06B
Net Income (ttm)	223.89M
Shares Out	652.17M
EPS (ttm)	0.34
PE Ratio	101.20
Forward PE	80.02
Dividend	0.05 (0.13%)
Ex-Dividend Date	May 24, 2024

Volume	202,100,909
Open	33.60
Previous Close	31.28
Day's Range	33.10 - 34.41
52-Week Range	13.44 - 34.41
Beta	0.30
Analysts	n/a
Price Target	n/a
Earnings Date	Oct 30, 2024

About China Wafer Level CSP

China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers CIS chips, TOF chips, image sensor chips, biometric identification chips, and MEMS chips and related products are widely used in smart phones, security monitoring digital, automotive electronics, identification, and other fields. The company also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, leadf...

• Industry: Semiconductors
• Sector: Technology
• Founded: 2005
• Employees: 861
• Stock Exchange: Shanghai Stock Exchange
• Ticker Symbol: 603005

Financial Performance

In 2023, China Wafer Level CSP's revenue was 913.29 million, a decrease of -17.43% compared to the previous year's 1.11 billion. Earnings were 150.10 million, a decrease of -34.30%.