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China Wafer Level CSP Co., Ltd. (SHA:603005)
China flag China · Delayed Price · Currency is CNY
32.75
-0.15 (-0.46%)
Aug 21, 2026, 3:00 PM CST

China Wafer Level CSP Dividend Information

China Wafer Level CSP has an annual dividend of 0.12 CNY per share, with a yield of 0.38%. The dividend is paid once per year and the last ex-dividend date was May 18, 2026.

Dividend Yield
0.38%
Annual Dividend
0.12 CNY
Ex-Dividend Date
May 18, 2026
Payout Frequency
Annual
Payout Ratio
17.08%
Dividend Growth
42.86%

Dividend History

Ex-Div Date AmountRecord DatePay Date
May 18, 20260.120 CNYMay 15, 2026May 18, 2026
Jul 4, 20250.084 CNYJul 3, 2025Jul 4, 2025
May 24, 20240.046 CNYMay 23, 2024May 24, 2024
Jul 10, 20230.070 CNYJul 7, 2023Jul 10, 2023
May 20, 20220.283 CNYMay 19, 2022May 20, 2022
Jun 15, 20210.14688 CNYJun 11, 2021Jun 15, 2021
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* Dividend amounts are adjusted for stock splits when applicable.

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