China Wafer Level CSP Co., Ltd. (SHA:603005)

Market Cap	21.33B +3.1%
Revenue (ttm)	1.52B +28.6%
Net Income	369.70M +37.5%
EPS	0.57 +39.4%
Shares Out	651.42M
PE Ratio	57.46
Forward PE	47.46
Dividend	0.12 (0.38%)
Ex-Dividend Date	May 18, 2026

Volume	23,724,143
Open	32.85
Previous Close	32.90
Day's Range	32.18 - 33.36
52-Week Range	25.92 - 55.26
Beta	0.86
Analysts	n/a
Price Target	n/a
Earnings Date	Aug 25, 2026

About China Wafer Level CSP

China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, lead frame, la...

• Industry: Semiconductors
• Sector: Technology
• Founded: 2005
• Employees: 1,088
• Stock Exchange: Shanghai Stock Exchange
• Ticker Symbol: 603005

Financial Performance

In 2025, China Wafer Level CSP's revenue was 1.47 billion, an increase of 30.44% compared to the previous year's 1.13 billion. Earnings were 369.62 million, an increase of 46.23%.

Data Sources: S&P Global Market Intelligence and Financial Modeling Prep

Fundamental and historical data is provided by S&P Global Market Intelligence. Delayed stock pricing data is provided by Financial Modeling Prep.

Last checked:

Aug 21, 2026

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