China Wafer Level CSP Co., Ltd. (SHA:603005)
China · Delayed Price · Currency is CNY 30.60
+0.61 (2.03%)
Aug 12, 2025, 2:45 PM CST
China Wafer Level CSP Dividend Information
China Wafer Level CSP has an annual dividend of 0.084 CNY per share, with a yield of 0.28%. The dividend is paid once per year and the last ex-dividend date was Jul 4, 2025.
Dividend Yield
0.28%
Annual Dividend
0.084 CNY
Ex-Dividend Date
Jul 4, 2025
Payout Frequency
Annual
Payout Ratio
12.31%
Dividend Growth(1Y)
82.61%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jul 4, 2025 | 0.084 CNY | Jul 4, 2025 |
| May 24, 2024 | 0.046 CNY | May 24, 2024 |
| Jul 10, 2023 | 0.070 CNY | Jul 10, 2023 |
| May 20, 2022 | 0.283 CNY | May 20, 2022 |
| Jun 15, 2021 | 0.14688 CNY | Jun 15, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.