China Wafer Level CSP Co., Ltd. (SHA: 603005)
China
· Delayed Price · Currency is CNY
28.60
+0.16 (0.56%)
Nov 20, 2024, 11:30 AM CST
China Wafer Level CSP Dividend Information
Dividend Yield
0.16%
Annual Dividend
0.046 CNY
Ex-Dividend Date
n/a
Payout Frequency
Annual
Payout Ratio
13.96%
Dividend Growth(1Y)
-34.29%
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
May 24, 2024 | 0.046 CNY | May 24, 2024 |
Jul 10, 2023 | 0.070 CNY | Jul 10, 2023 |
May 20, 2022 | 0.283 CNY | May 20, 2022 |
Jun 15, 2021 | 0.14688 CNY | Jun 15, 2021 |
May 19, 2020 | 0.05208 CNY | May 19, 2020 |
* Dividend amounts are adjusted for stock splits when applicable.