China Wafer Level CSP Dividend Information

Dividend Yield

0.19%

Annual Dividend

0.046 CNY

Ex-Dividend Date

n/a

Payout Frequency

Annual

Payout Ratio

13.96%

Dividend Growth

-34.29%

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
May 24, 2024	0.046 CNY	May 23, 2024	May 24, 2024
Jul 10, 2023	0.070 CNY	Jul 7, 2023	Jul 10, 2023
May 20, 2022	0.283 CNY	May 19, 2022	May 20, 2022
Jun 15, 2021	0.14688 CNY	Jun 11, 2021	Jun 15, 2021
May 19, 2020	0.05208 CNY	May 18, 2020	May 19, 2020

* Dividend amounts are adjusted for stock splits when applicable.