China Wafer Level CSP Co., Ltd. (SHA: 603005)
China
· Delayed Price · Currency is CNY 34.49
+0.08 (0.23%)
Nov 13, 2024, 3:00 PM CST
China Wafer Level CSP Dividend Information
China Wafer Level CSP has an annual dividend of 0.046 CNY per share, with a yield of 0.13%. The dividend is paid once per year and the last ex-dividend date was May 24, 2024.
Dividend Yield
0.13%
Annual Dividend
0.046 CNY
Ex-Dividend Date
May 24, 2024
Payout Frequency
Annual
Payout Ratio
13.96%
Dividend Growth(1Y)
-34.29%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 24, 2024 | 0.046 CNY | May 24, 2024 |
| Jul 10, 2023 | 0.070 CNY | Jul 10, 2023 |
| May 20, 2022 | 0.283 CNY | May 20, 2022 |
| Jun 15, 2021 | 0.14688 CNY | Jun 15, 2021 |
| May 19, 2020 | 0.05208 CNY | May 19, 2020 |
* Dividend amounts are adjusted for stock splits when applicable.