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China Wafer Level CSP Co., Ltd. (SHA:603005)
China flag China · Delayed Price · Currency is CNY
33.61
-0.96 (-2.78%)
Feb 28, 2025, 2:45 PM CST

China Wafer Level CSP Dividend Information

China Wafer Level CSP has an annual dividend of 0.046 CNY per share, with a yield of 0.14%. The dividend is paid once per year and the last ex-dividend date was May 24, 2024.

Dividend Yield
0.14%
Annual Dividend
0.046 CNY
Ex-Dividend Date
May 24, 2024
Payout Frequency
Annual
Payout Ratio
13.96%
Dividend Growth
-34.29%

Dividend History

Ex-Div Date AmountRecord DatePay Date
May 24, 20240.046 CNYMay 23, 2024May 24, 2024
Jul 10, 20230.070 CNYJul 7, 2023Jul 10, 2023
May 20, 20220.283 CNYMay 19, 2022May 20, 2022
Jun 15, 20210.14688 CNYJun 11, 2021Jun 15, 2021
May 19, 20200.05208 CNYMay 18, 2020May 19, 2020
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts