China Wafer Level CSP Co., Ltd. (SHA:603005)

China Wafer Level CSP Ratios and Metrics

Market cap in millions CNY. Fiscal year is January - December.

Fiscal Year	Current	FY 2024	FY 2023	FY 2022	FY 2021	FY 2020
Period Ending	Oct 23, 2025	Dec 31, 2024	Dec 31, 2023	Dec 31, 2022	Dec 31, 2021	Dec 31, 2020
Market Capitalization	19,438	18,424	14,306	12,096	22,441	20,695
Market Cap Growth	68.87%	28.78%	18.27%	-46.10%	8.44%	128.81%
Enterprise Value	17,220	16,109	12,185	9,905	20,346	19,605
Last Close Price	29.84	28.16	21.84	18.38	33.82	32.80
PE Ratio	63.46	72.89	95.31	52.95	38.96	54.23
Forward PE	56.30	56.22	30.23	25.67	32.82	41.94
PS Ratio	15.40	16.31	15.66	10.94	15.90	18.75
PB Ratio	4.33	4.28	3.47	3.01	5.69	6.15
P/TBV Ratio	4.78	4.73	3.87	3.37	6.50	6.27
P/FCF Ratio	-	85.48	150.82	45.34	90.53	57.52
P/OCF Ratio	49.66	51.83	46.82	30.88	36.60	42.77
EV/Sales Ratio	13.64	14.26	13.34	8.96	14.42	17.77
EV/EBITDA Ratio	47.61	48.15	44.42	31.42	32.63	40.03
EV/EBIT Ratio	77.47	90.25	118.22	63.61	42.29	53.91
EV/FCF Ratio	-252.05	74.74	128.46	37.13	82.07	54.50
Debt / Equity Ratio	0.07	0.03	0.08	0.04	0.01	-
Debt / EBITDA Ratio	0.91	0.31	1.25	0.48	0.08	-
Debt / FCF Ratio	-	0.49	3.66	0.57	0.21	-
Asset Turnover	0.26	0.24	0.19	0.25	0.34	0.37
Inventory Turnover	6.41	6.99	5.30	5.11	5.43	6.01
Quick Ratio	4.77	7.80	5.43	5.60	6.90	9.83
Current Ratio	4.99	8.09	5.69	5.90	7.36	10.23
Return on Equity (ROE)	6.95%	6.00%	3.83%	5.86%	15.83%	14.27%
Return on Assets (ROA)	2.84%	2.33%	1.37%	2.15%	7.34%	7.52%
Return on Capital (ROIC)	3.06%	2.51%	1.49%	2.38%	8.17%	8.50%
Return on Capital Employed (ROCE)	4.80%	4.10%	2.40%	3.70%	11.70%	10.40%
Earnings Yield	1.58%	1.37%	1.05%	1.89%	2.57%	1.84%
FCF Yield	-0.35%	1.17%	0.66%	2.21%	1.10%	1.74%
Dividend Yield	0.28%	0.30%	0.21%	0.38%	0.52%	0.37%
Payout Ratio	0.58%	13.71%	36.56%	51.03%	13.84%	6.02%
Buyback Yield / Dilution	0.46%	0.69%	0.02%	0.29%	-6.32%	2.28%
Total Shareholder Return	0.75%	0.99%	0.23%	0.67%	-5.79%	2.65%

Updated Jun 30, 2025. Source: S&P Global Market Intelligence. Standard template. Financial Sources.